3DSPI 3Si- Series
SAKI’s 3D Solder Paste Inspection Machine (3D SPI) 3Si Series
Key Features
- Rigid gantry structure
- Self-diagnostic functions
- Rigid gantry structure and dual motor-drive system
- High resolution linear scale for accurate positioning
- Increased conveyor speed
- Newly developed high-speed mode increases measurement and inspection speed by about 190%
- Warpage adjustment
- Coplanarity inspection
- SPC function
- History Management System for data logging and history
- Golden & Silver Sample Check Function for process verification
Advantages
- Saki Self-Programming (SSP) Software
- Scalable optical resolutions of 7µm, 12µm, and 18µm
- CoaXPress camera for faster inspection & measurement process
- Simultaneous 2D and 3D inspection of the entire board
- Flexible gantry for M/L/XL PCBA sizes and dual lanes
- One common platform supports 3D-SPI, 3D-AOI, and 3D-AXI
Application Images
Technical Data
| Dimensions | L- Single Lane | L-Duel Lane | XL Single Lane | |
| Model Name | 3Si-LS2 | 3Si-LD2 | 3Si-ZS2 | |
| PCB Size （mm, in.） | 7μm camera head | Single mode | Dual mode | 50×60〜686×870, 1.97×2.36〜27.00×34.25 |
| 7μm camera head | ||||
| 50×60〜330×330, 1.97×2.36〜12.99×12.99 | 50×60〜 330×330, 1.97×2.36〜 12.99×12.99 | 50×60〜 320×330, 1.97×2.36〜 12.60×12.99 | ||
| 12/18μm camera head | 12/18μm camera head | |||
| 50×60〜500×510, 1.97×2.36〜19.68×20.07 | 50×60〜 500×510, 1.97×2.36〜 19.68×20.07 | 50×60〜 320×510, 1.97×2.36〜 12.60×20.07 | ||
| PCB Clearance | Top：40mm, 1.57in. Bottom：60mm, 2.36in | Top：40mm, 1.57in. Bottom：50mm, 1.96in. | Top：40mm, 1.57in. Bottom：60mm, 2.36in | |
| Size (W)X(D)X(H) (mm,in) | 1040×1440×1500, 40.94×56.69×59.06 | 1040×1440×1500, 40.94×56.69×59.07 | 1340×1440×1500, 52.75×56.69×59.06 | |
| Weight | 900kg, 1984.16lb | 900kg, 1984.16lb | 900kg, 1984.16lb | |
| Electric Power | Single Phase〜200-240V+/-10%, 50/60Hz | |||
| Air Requirement | 0.5MPa, 5L/min（ANR） | |||