3Xi-M110
Key Features
- Acquires high-quality CT images of planar objects using fewer projections
- Identifies various defects in 3D images.
- High accuracy true 3D automatic inspection
- Displays actual measurement and target point with 3D images
- Displays defects in high-precision 3D color images
- Inspection of standard PCBs, components and solder joints, and other electric components
- Optimized Planar Computed Tomography (PCT) technology algorithm
- Detection and measurement of voids in multilayer PCB power modules
- The new X-ray tube powers-on the emitter only during image capture, reducing X-ray exposure by up to 70%.
Advantages
BGA Head-in-pillow (HiP)
Able to distinguish shapes of non-wetting faults such as BGA head-in-pillow, which are difficult to detect. Capable of analyzing both void volume ratio and void area ratio.
THT (Through-hole-technology) By measuring the solder quantity in through-holes (filling rate), the system reliably discovers defects in THT assemblies that that standard tomography inspection systems would overlook.
Chip Components
Determines whether a chip component is good or bad based on changes in fillet position, height, width, angle, solder quantity. Visualizes the fillet shape of non-wet chips
IC Components
Capable of judging whether an IC component is good or bad based on changes in fillet position, height, width, angle, solder quantity. Detects bridge defects when solder crosses between leads. Visualizes the fillet shape of a non-wet lead.
Application Images
Technical Data
| odel | 3Xi-M110 |
| Size (W) x (D) x (H) [Main body]mm (in.) | 1380 x 2150 x 1500 (54.34 x 84.65 x 59.06) |
| Weight | Approx. 3100 Kg (6834.34 lbs) |
| Electric Power Requirement | Three-phase 200V +/ 10%, 50/60Hz 4.2 kVA With Cable 5m |
| Resolution | 10μm-30μm |
| Tube | 110kV 30W, Closed X-ray Source |
| Xray leakage | 0.5μSv/h or less |
| Air Requirement | 0.5MPa @ ≥ 20L/min (ANR) |
| Target PCB Size mm (in.) | 50 W x 120 L – 360 W x 330 L (1.97 W x 4.73 L – 14.17 W x 12.99 L) |
| 50 W x 120 L – 360 W x 510 L ※ (1.97 W x 4.72 L – 14.17 W x 20.07 L)※ | |
PCB Clearance | Top: 60 mm (2.36 in.) Bottom: 40 mm (1.57 in.) |
3Xi-M200
For IGBTs Highly accurate volumetri inspection using “Real 3D” image data
Key Features
- Acquires high-quality CT images of planar objects using fewer projections
- Small and lightweight 1,400mm wide and 5,100kg
- Saves manufacturing floorspace, enables easy installation, and improves production-line operation
- The platform handles board sizes of 50 x 140mm (W x L) to 360 x 330mm (W x L)
- For larger 360 x 510mm (W x L) boards, 2-step image capture is available
- The machine’s cast iron frame maintains the rigidity needed for stable operation
- improve image capture speed by 30%, reducing production-line takt time
Advantages
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Application Images
Clearer inspection of voids by processing image to remove shadows of external cooling fins. Automatic measurement and image correction of part warpage ensures high-precision inspection
Advanced image-processing software removes images of DBC traces that interfere with inspection, enabling more accurate measurement of voids.
Technical Data
| Model | 3Xi-M200 |
| Size (W) x (D) x (H) [Main body]mm (in.) | 1400 x 2580 x 1862 (55.12 x 101.58 x 73.31) |
| Weight | Approx. 5100 Kg (11243.58 lbs) |
| Electric Power Requirement | Three-phase 200V +/ 10%, 50/60Hz 4.2 kVA With Cable 5m |
| Resolution | 25μm-80μm |
| Tube | 200kV 30W, Open X-ray tube |
| Xray leakage | 0.5μSv/h or less |
| Air Requirement | 0.5MPa @ ≥ 20L/min (ANR) |
| Target PCB Size mm (in.) | 50 W x 140 L – 360 W x 330 L (1.97 W x 5.52 L – 14.17 W x 12.99 L) 50 W x 140 L – 360 W x 510 L ※ (1.97 W x 5.52 L – 14.17 W x 20.07 L)※ |
PCB Clearance | Top: 60 mm (2.36 in.) Bottom: 40 mm (1.57 in.) |