Key Features
- Fein-Focus X-ray open tube technology.
- Next generation CT and automated inspection
- Detail detectability: < 500 nm & < 350 nm. (As per JIMA Gauge Comparison Standard)
- Best-in-class Laminography with micro3Dslice which provides a substantial cost savings over micro sectioning
- FF CT software with improved workflow
- Optimized to customer specifications
- Software modules available for automatic inspection of BGAs and die-attach
- Standard 5 axis manipulator system (optional 8-axis system)
- Oil free vacuum pump
Advantages
- Accurate, fast, and repeatable inspections – manually and automatically
- High-power, High-resolution inspection of very small features
- Easy to use, dynamic enhancing filters, e.g., eHDR
- Fast, automated, easy routines
- Ultimate quality resolution for failure analysis applications
- Best available laminography (micro3Dslice)
Application
- SMT and PTH assemblies
- PCBs
- IGBTs
- Wafer inspection
- 3D integrated circuit joints
- Microbumps
- Sensors
- MEMS and MOEMS
- TSVs
- Batteries
- Connectors
- Various hard-to-see electronic components
- Medical material
- Military and space electronics
Application Images
Technical Data.
| Attribute | Respective Value |
| Sample Size | 800 x 500 [mm] (31” x 19”) |
| System Dimensions (W/D/H) | 1650 x 1400 x 2050 [mm] |
| System Weight | 2200 kg |
| FeinFocus X-ray Tube | FXT-160.50 Microfocus or FXT-160.51 Multifocus, 20 – 160 kV voltage range |
| Detector Active Area | 1004 x 620 px (Y.Panel 1308), 1004 x 1004 px (Y.Panel 1313), 1276 x 1276 px (ORYX 1616) |
| Pixel Pitch | 127 µm2 |
| Bit Depth | 16 bit |
| Oblique Viewing | +/- 70° (140°) |
| Max. Radiographic Area | 460 x 410 [mm] (18” x 16”) |
| 3D Modes | Laminography (micro3Dslice), CT Quick Scan, Quality Scan |